The printed front &rear contacts are fired into the PN junction layer to form an ohmic contact through firing process,which allows the electrical energy collected by the fingers to flow out through the busbars.
工藝流程 Process Flow
烘干→預燒結→主燒結→冷卻
Drying→Pre-firing→Firing→Cooling
技術特點 Features
1、雙軌產線,機架電氣完全獨立,互不干擾。 Dual-track production line, the rack and electrical parts completely independent without interfering operations of each other.
2、CT≤0.95s秒。 CT≤0.95s.
3、大產能:實際產能達到175000片/天。 High throughput: actual throughput up to 175,000 pcs/day.
4、A級片源,單晶碎片率0.03%。 A grade wafers, mono breakage rate 0.03%.